Feature
Selective spray flux: according to the PCB structure, the user can edit the program to plan the X-Y movement path of the spray flux.
Selective wave soldering: Selectively soldering the PCB according to the user's program path X-Y-(Z).
Tin furnace: patent square nozzle design, furnace bladder anti-corrosion treatment; High temperature motor drive, fully enclosed impeller, low design; Electromagnetic pump tin stove is optional.
Manipulator + motion control: the movement of PCB relative to tin stove adopts X-Y-(Z) right-angle manipulator, servo/stepper motor drive; Ball screw + linear guide way; Motion control card, path and add/subtract speed control.
Preheating: Preheating temperature, preheating time, preheating path program can be adjusted, users can flexibly use infrared + hot air preheating process;
Nitrogen system: with nitrogen pressure adjustment, flow control, advance heating, nitrogen cap.(option)
Equipment operation: single person (or robot) to take and put the board operation.
Specification
Model |
ND35T |
PCB Size |
50*50—350*300mm |
Working mode |
Single person offline operation |
Flux coating |
Selective spray |
Flux tank capacity |
2L |
Preheating Zone Power |
2KW, Option |
Solder capacity |
16Kg |
Solder temperature |
1.5KW,Room temperature -400℃ |
Spray height of tin |
0--15mm |
Movement way |
Tin stove fixed PCB move |
Control method |
Control card + programmer |
Starting power |
1.5KW |
Operating power |
0.5—1KW |
Power supply |
1P AC220V 50Hz+N+G,1.5 KW / 3KW |
Net Weight |
180KG |
Dimension |
960(L)* 1250(W)* H935(H)mm |
Packing |
1100(L)* 1250(W)* H935(H)mm |
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