Function
Detection type
Component defects such as whether there is solder paste, offset, insufficient solder, excess solder, open circuit and contamination;
mounting defects such as missing part, offset, skewing, tombstone, mounting on side, turnover, wrong parts, damage and reversal, etc.;
solder joint defects such as excess solder, insufficient solder, pseudo soldering, and solder bridge, etc.;
and PCB defects such as copper foil contaminated, black pad, de-lamination, copper foil missing, and oxidation, etc.
Image recognition
Automatically set the parameters (e.g. shift, polarity, short circuit, etc.) according to different inspection requirements.
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