T20 L
Inside reflow oven is a heating circuit that heats air or nitrogen to a temperature high enough to blow into the printed circuit board, allowing the solder on either side of the component to melt and bond to the motherboard.
Specification
| Model | ND T20L |
| Belt Width(mm) | 400 |
| Available max. height of component | <30mm |
| Max Speed of Conveyor (mm) | <1200mm/min |
| Noise intensity | 75db |
| Temperature preheating time | 15min |
| Temperature range control | room temperature~ 400℃ |
| Temperature accuracy | +/-1℃ |
| Temperature distributing deviation on PCB | +/-2℃ |
| Temperature preheating time | 15min |
| Length*Width*Height (mm) | 4800*900*1250mm |
| Net Weight | 800KG |
| Gross Weight | 870KG |
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